Product Overview
The 5µm pure tungsten probe is a high-precision testing needle designed for wafer-level testing, semiconductor probing, and other micro-electronic detection applications. With a minimum tip diameter as fine as 1µm and precision up to ±0.5µm, it ensures accurate, stable, and repeatable testing results for advanced integrated circuits.
As semiconductor technology evolves, wafers are becoming more complex and miniaturized. This makes wafer testing a critical step in guaranteeing chip performance and reliability before packaging. Tungsten probes, as the core component of probe cards and testing fixtures, account for up to 70% of the total cost of the test fixture, making their quality and precision a decisive factor in the entire testing process.
Key Features & Advantages
-
🔬 Ultra-Fine Precision – tip diameter down to 1µm, ensuring accurate wafer contact and signal stability
-
🛡️ High Strength & Durability – tungsten’s superior hardness and wear resistance guarantee long service life
-
⚡ Excellent Conductivity – low contact resistance for stable and reliable test signals
-
🔥 High Temperature & Corrosion Resistance – maintains stability under harsh test conditions
-
🎯 Customizable Design – length, diameter, tip shape, and plating (gold, nickel, etc.) available for specific test environments
Applications
Semiconductor & Electronics
-
Wafer-level chip testing before packaging
-
Probe cards (cantilever, vertical, MEMS)
-
Docking units and probe interfaces (PIB)
-
IC test sockets, chip-scale package testing
-
High-frequency and high-density testing scenarios
Research & Development
-
Microelectronics material research
-
Precision probing for laboratory analysis
-
Failure analysis and reliability testing
Precision Equipment Manufacturing
-
Custom probes for OEM semiconductor testing equipment
-
Replacement probes for international probe card systems
Industry Importance
-
Critical Role in Wafer Testing: The probe is the core consumable in probe cards and docking systems, directly affecting testing accuracy and yield.
-
Cost Contribution: Probes account for ~70% of the cost of test fixtures, making high-quality tungsten probes a strategic investment.
-
Quality Assurance: With the rise of AI chips, 5G, HPC, and automotive-grade semiconductors, ensuring probe reliability directly impacts chip manufacturers’ competitiveness.
Customization Options
We offer OEM/ODM services to meet specific testing requirements:
-
Tip size: 1–20µm (custom)
-
Tip shape: conical, flat, wedge, or ball-shaped
-
Length: 20–50mm (customizable beyond standard 27mm, 35mm, 38mm)
-
Coating: Gold, Nickel, or Rhodium for improved conductivity & oxidation resistance
-
Batch production with quality inspection reports
Why Choose Xinxin Precision?
-
30+ years of tungsten material expertise
-
One-stop production: tungsten sintering → precision machining → surface finishing
-
Global semiconductor clients in IC packaging, testing, and R&D sectors
-
Engineer-to-engineer technical support, ensuring tailored solutions for your test systems
Request a Quote Today
For detailed specifications, bulk orders, or custom designs, please contact:
-
Email: info@machinedesign.top
-
Phone: +86 15999653684
-
Website: machinedesign.top
